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Thermal Squares, 1in, 10 Pack, Ziotek, ZT1480012 |
| Item #: |
148 0012 |
| Brand: |
Ziotek |
| Model #: |
ZT1480012 |
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| Tuesday, January 28, 2014 5:33:26 PM |
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| Pros: none |
| Cons: Clear plastic covering on one side of pad peeled off easily. White paper on other side embossed with "Sentra Team Parker" would not peel at all. Since it is double the size of the pad and glossy on the outside, I assume it is not part of the heatsink compound and must be removed for the compound to work properly. Since it won't come off, the product is unusable. I can't risk damaging a $180 chip with a poorly designed $3 heat sink pad. I'll have to buy something else. |
| Other Thoughts: These pads should ship with some instructions for proper use, or with a link to a website or youtube video showing how to use them. As it is, I'll just write the purchase off as a bad experience and move on. |
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Flawed, and it is NOT "tape" |
| Clint - Own a computer hardware and custom PC business |
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| Saturday, January 16, 2010 11:27:43 PM |
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| Pros: None. |
| Cons: There are no "Pros". I agree with the other reviewer. First, this is NOT "tape" as they describe, it's a PAD. Tape is implied as being ADHESIVE, which these are not and are not properly described. These PADS have no adhesive characteristics. I needed something to attach heatsinks to RAM chips on video cards and hot chips on mobo's, etc. These will not work for that because the heatsink to which they are attached just falls off. They are also impossible to use. You cannot separate them from the ridiculous backing without damaging the PAD to the point where it's unusable! Anyone that knows about PC's and heat transfer knows that if a PAD is not pristine, the CPU could fry. Any air bubbles, gaps, and UNEVENNESS between the PAD and hot surface is bad. These PADS, after you try to remove them from the backing, are "rippled", "crimped", totally uneven making for a dangerous TIM (thermal interface material). |
| Other Thoughts: If that non-release problem were fixed, they could at least be used in applications where heatsink mechanical retention was available. |
Response From Cyberguys Tech:
Thanks to your suggestions, we have renamed this product from "thermal tape" to "thermal squares." The product does not involve adhesive and we regret any misunderstandings. For those looking for more professional thermal transfer solutions, we (and many experts) recommend the Arctic Silver products, also available on this site. |
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Flawed, and it is NOT "tape" |
| Clint - Own a computer hardware and custom PC business |
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| Thursday, January 14, 2010 1:35:38 AM |
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| Pros: None. |
Cons: There are no "Pros". I agree with the other reviewer. First, this is NOT "tape" as they describe, it's a PAD. Tape is implied as being ADHESIVE, which these are not and are not properly described. These PADS have no adhesive characteristics. I needed something to attach heatsinks to RAM chips on video cards and hot chips on mobo's, etc. These will not work for that because the heatsink to which they are attached just falls off.
They are also impossible to use. You cannot separate them from the ridiculous backing without damaging the PAD to the point where it's unusable! Anyone that knows about PC's and heat transfer knows that if a PAD is not pristine, the CPU could fry. Any air bubbles, gaps, and UNEVENNESS between the PAD and hot surface is bad. These PADS, after you try to remove them from the backing, are "rippled", "crimped", totally uneven making for a dangerous TIM (thermal interface material). |
| Other Thoughts: If that non-release problem were fixed, they could at least be used in applications where heatsink mechanical retention was available. |
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| Friday, October 9, 2009 1:36:38 PM |
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| Pros: None. |
| Cons: The tape has paper on both sides. The paper on one side comes off easily enough. The paper on the other side refused to come off. I peeled off a little of it, but then it ripped and the rest stayed stuck to the tape. Tried putting it in a freezer for awhile, but the paper still couldn't be peeled off afterwards. I finally gave up and used thermal paste instead. |
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